Cypress Semiconductor CY8C24894 Manuale Utente Scaricare il pdf (Pagina 38)

CY8C24094, CY8C24794

CY8C24894, CY8C24994

Document Number: 38-12018 Rev. *Q Page 38 of 48

11. Packaging Dimensions

This section illustrates the package specification for the CY8C24x94 PSoC devices, along with the thermal impedance for the package

and solder reflow peak temperatures.

Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of

the emulation tools’ dimensions, refer to the document titled

PSoC Emulator Pod Dimensions at

http://www.cypress.com/design/MR10161.

Figure 11-1. 56-Pin (8x8 mm) QFN

001-12921 **

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Cypress Semiconductor CY8C24894 Manuale Utente Pagina 38